CVD chamber cleans are non-productive steps consuming valuable tool time and requiring expensive and environmentally caustic chemicals. Optimization improves throughput by reducing clean time. When CVD limits overall manufacturing output, clean optimization can avert the necessity of purchasing new tools.
Increased throughput of almost 80% has been reported by simply optimizing chamber cleans.
Reduce Consumable Expense While Helping the Environment
NF3 is the dominant CVD chamber cleaning gas used throughout the semiconductor and display industries. Yet, NF3 is a 17000 times more potent greenhouse gas than the same mass of CO2 and survives 5 times longer. Get 20-30% in NF3 consumption savings via clean optimization and reduce overall CVD process cost while
improving the environment.
Particles are a known yield limiting issue. In the CVD process, particles are generated by under cleaning and leaving residual film which builds up or by over cleaning and etching the chamber components. Clean optimization avoids both conditions by stopping the clean process as soon as the film is removed from
chamber components. All Forth-Rite optimization solutions include process excursion detection capabilities to immediately alert manufacturing should an excursion occur.
