MicroLED display technology developer X Display Company (XDC) announced that it installed the world's first 300 mm elastomer stamp based mass MicroLED transfer equipment late in 2020. This tool was installed in the US and the company hopes to start shipping several similar tools for its customers later in 2021.

XDC spun out of X-celeprint in 2019 and retained the equipment organization from that transaction. XDC has over 15 years of experience with mass transfer micro printing technologies, and is offering a range of tools for microLED transfer, suitable for R&D work and industrial-scale production.

Seoul Viosys says that the company expects to receive its first microLED revenues in Q2 2021. The company, together with Seoul Semiconductors, developed a new MicroLED technology, called Micro Clean LED that basically packages three separate LEDs (red, green and blue) into a single "one-single MicroLED pixel".

The idea is that these packaged colored pixels will be easier to transfer to the target substrate compared to the transfer of three different LEDs. The package itself does not contain any driver ICs.

Singapore-based electronics assembly solutions provider Kulicke & Soffa announced that it has acquired Uniqarta, a US-based developer of MicroLED placement technology.

Uniqarta developed a unique LED die transfer technology that uses ultra-fast lasers to enable contactless LED de-bonding and placement solution. Uniqarta's technology is branded as Laser-Enabled Advanced Placement, or LEAP).