microLEDs: Market Data, Value Chain, Laser Printing, Laser Lift Off, Trimming, LIFT, Hybridization, Monolithic Integration
In this newsletter you can learn about the following technologies.
We will have the opportunity to download the full slides.
- Holst Center | Laser Die Transfer at Holst Centre
- Yole Intelligence | Status of the MicroLED Industry
- CEA | Key challenges for hybridizing GaN micro LEDs and CMOS circuits
- 3D-Micromac | Laser Technology for the Production of MicroLED
To learn more about MicroLED, please join MicroLED Connect.
MicroLED Connect is the world’s first MicroLED Conference and Exhibition taking place on 25 & 26 September 2024 at the High Tech Campus in Eindhoven, Netherlands. Explore preliminary agenda here.
1. Laser Die Transfer at Holst Centre
Holst Center | October 2023
Here you can learn about the following key
points:
- Miniaturization of LEDs
- Yield and defect management
- Laser Printing and the FAST-CT Process
- Laser mass transfer from native wafer to substrate with Holst Centre's release stack
- Current status/achievements of the technology including release speed, pitch, UPH, Yield, Accuracy, etc
- Adaptive pitch and using 100% of wafer space
- Comparison with other laser based solutions
- Flip chip bonding
- Laser printing
and control of heat flux
- Fine interconnect laser printing
- Solder laser printing
- Roadmap
Download Presentation Slides
2. Status of the MicroLED Industry
Yole Intelligence | November 2023
Here you can learn about the following key points:
- Supply chain
overview
- Examples of manufacturing ramp-ups
- Examples of products and prototypes on the market
- OLED improvement and roadmap shifting the goal posts
- Smartwatch display modules prices and technology for Apple
- TV market: price adoption vs price
- 4K TV Cost breakdown
- MicroLED performance differentiation per application
- Key differentiations including modular display and in-display sensors
- Thin film transistors (TFTs) vs Si-CMOS
Microdrivers
- MicroLED Panel forecasts by application (base and aggressive scenarios)
Download Presentation Slides
|
3. Key challenges for hybridizing GaN micro-LEDs and CMOS circuits
CEA | November 2022
Here you can learn
about the following key points:
- Why hybridization of GaN MicroLEDs and CMOS circuits
- Approaches towards MicroLED and CMOS Intgeration including hybridization, direct bonding and hybrid bonding
- Flip chip hybridization techniques
- Microtubes
- Hybrid bonding
- Monolithic integration
Download Presentation Slides
4. Laser Technology for the Production of MicroLED
3D-Micromac | November 2022
Here you can learn about the following key points:
- Laser solutions for display
manufacturing
- Laser Lift Off (LLO) Process
- LLO Process with microMIRA and technical data including throughput, process time, line beam, etc
- LIFT (Laser Induced Forward Transfer): Throughput Calculations
- Trimming and Repair on-the-fly
- microVGA Trim (technical parameters)
Download Presentation Slides
