At Perovskite-Connect 2025, Sofab Inks will discuss its effort to explore materials that can increase the performance of perovskite devices, and are also scalable for mass production. The company’s soluble ETL and HTL materials offer a solution for the industry that balances performance and manufacturability.
Germany-based Karlsruhe Institute of Technology (KIT) will
introduce its research into metallization and interconnection materials that can be processed at low temperatures. One of its key achievements is the TECC wire concept which uses round copper wires for cell interconnection. These polymer-coated wires offer good adhesion to the cell structure, high performance, low silver content and a gentle processing condition.
Nano-C is also developing interface materials for single-junction and tandem perovskite panels.
The company will discuss how its experience with fullerenes and fullerene derivatives has enabled it to develop novel electron transporting interface materials that allow for passivation and prevention of delamination, and will also discuss specific use cases of the materials and its industrial scale manufacturing of fullerenes and new generation fullerene derivatives.
Finally, industrial adhesive developer DELO will explain why high-barrier encapsulants are
essential for the protection of perovskite solar cells, and will demonstrate how it developed new adhesive solutions specifically designed for perovskite solar cells.
Perovskite-Connect 2025: time to reserve your ticket now!
These are just a few sample themes from our exciting world-class agenda, that includes a range of solar panel makers, equipment manufacturers, process developers, researchers and more. Perovskite-Connect is co-located with The Future of Electronics Reshaped printed electronics event, a highly relevant conference with a focus on printed materials, processes and technologies.